JPH0328528Y2 - - Google Patents
Info
- Publication number
- JPH0328528Y2 JPH0328528Y2 JP1983154482U JP15448283U JPH0328528Y2 JP H0328528 Y2 JPH0328528 Y2 JP H0328528Y2 JP 1983154482 U JP1983154482 U JP 1983154482U JP 15448283 U JP15448283 U JP 15448283U JP H0328528 Y2 JPH0328528 Y2 JP H0328528Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- base
- emitting diodes
- emitting diode
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
Landscapes
- Dot-Matrix Printers And Others (AREA)
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983154482U JPS6061748U (ja) | 1983-10-04 | 1983-10-04 | 発光ダイオ−ドアセンブリ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983154482U JPS6061748U (ja) | 1983-10-04 | 1983-10-04 | 発光ダイオ−ドアセンブリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6061748U JPS6061748U (ja) | 1985-04-30 |
JPH0328528Y2 true JPH0328528Y2 (en]) | 1991-06-19 |
Family
ID=30341472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983154482U Granted JPS6061748U (ja) | 1983-10-04 | 1983-10-04 | 発光ダイオ−ドアセンブリ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6061748U (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5780077A (en) * | 1980-11-06 | 1982-05-19 | Matsushita Electric Ind Co Ltd | Heat-sensitive recording head |
-
1983
- 1983-10-04 JP JP1983154482U patent/JPS6061748U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6061748U (ja) | 1985-04-30 |
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